Nabtesco Corporation
TS Heatronics Co,. Ltd. TS Corporation
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Using the heat transfer by Heatlane™ technology, the cooling area of Peltier elements can be enlarged. This feature improves the cooling performance and contribute to power saving. Also, by combining with the small and high performance Heatlane™ heat sink, the space of the radiation section of the Peltier elements can be reduced.


SLC type (also can be used as a heat sink)
 
What is Heatlane™ heat absorber?
Heatlane™ heat absorber uses AL-EX Heatlane™ plate as its material, the same as Heatlane™ heat sink. Since Heatlane™ technology can efficiently transfer heat, the heat absorption effect of Peltier elements is remarkably enhanced.


Specifications
  Size: 380W x 120D x 30H* (mm) * including 5mmT base plate.
  Weight: Approx. 1.3kg
 
  Typical performance
 
Ambient temperature Air flow velocity Peltier element
cooling surface
temperature
25oC 15oC 5oC
45oC 1.5m/s Heat absorption rate 140W 214W 305W
 
Want to solve thermal problems with Heatlane™ technology.


TS Heatronics Co,. LTD.