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| Taking advantage of Heatlane™ technology
that quickly transfers heat regardless of its position, the
heat spreader which minimizes the temperature difference within
a surface, which is useful to control the surface at constant
temperature. The following example shows the application of
the hot plate/cooling plate for silicon wafer manufacturing
devices. |
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※ The picture shows the internal structure.
(Stainless steel) |
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| Features |
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The temperature was controlled by many heaters or Peltier
elements so far, it is now controlled by less heaters
or Peltier elements. |
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| Specification |
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Outer dimensions: |
x 3t (mm) |
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Weight: |
2.7kg (in case of copper) |
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Material: |
Copper, stainless steel, etc |
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Temperature uniformity (in case of copper)
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Power dissipation 220W (at center) |
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| Test sample |
Same size solid copper plate |
Heatlane™ heat spreader |
| Temperature distribution
in surface |
27.1oC |
5.4oC |
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