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Heatlane™ is our core technology, which circulates
the working
fluid within the meandering capillary tube. The technology
based on the operative principle which is completely different
from the conventional heat pipe. The technology realizes
effective heat transfer conducted not only horizontally
but also from top to bottom (top heat) as well as better
heat transfer capability than the conventional heat pipe.
Heatlane™ technology is called meandering capillary
tube heat pipe, or self-excited oscillation (pulsation)
heat pipe or Akachi pipe named after Hisateru Akachi,
the inventor who is former vice president (now consultant)
of our company. The technology is, with its epoch-making
features, attracting deep concern of companies, universities
and research institutes all over the world, resulting
in the award
of the technology prize of the Japan Association for Heat
Pipe for the year 2002. |
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| Main features |
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Since the heat transfer capability is not extremely
affected by its applied position it is applied.
The design flexibility of applicable products are
expanded. |
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Hardly being affected by the gravity, it is operative
even in 9G accelerated environment or non-gravity
environment. |
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Because both latent and sensible heat are transferred,
its heat transfer capacity overwhelms the conventional
heat pipe performance.* |
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While the
maximum heat transfer density of the wick-type
micro heat pipe using water as the working
fluid (having square cross section, 1x1mm)
is 5x105W/m2, that of
the SEMOS heat pipe (= Heatlane™ plate)
is higher by approximately one digit, in spite
of the fact that its cross section is smaller
than the micro heat pipe (excerpted from "Study
on thermal characteristics of SEMOS Heat Pipe"
by Dr. Nishio, chief of Institute of Industrial
Science, University of Tokyo). |
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By adjusting the number of turns of the capillary
tube, the heat transfer capability can be adjusted.
This enables of applicable range from small to large
capacity. |
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Using a tube without internal structure such as
wicks as a container, the meandering capillary tube
can be bent freely without extreme deterioration
of the performance. |
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Various liquids, other than water, can be applicable
as the working fluid, Heatlane™ works even under
zero centigrade condition. |
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The flat shape of Heatlane™ plate enables flat
surface mount. |
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Various materials can be used as the container
including aluminum, copper, stainless steel and
titanium. |
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| [Heatlane™ technology] |
[Conventional Heat Pipe] |
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| Shot by: |
Radiation Laboratory,
Department of Nuclear Engineering, Kyoto
University. |
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Department of Mechanical
Engineering, Fukui University of Technology |
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| Patent |
| We have obtained or applied for the patent for Heatlane™
technology in six countries in the world. |
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| Collaboration institutes |
Tokyo University, production technology research institute
Kyoto University Graduate School, engineering research
team, nuclear engineering course, radiation laboratory
Fukui Industrial University, Engineering Faculty, machine-engineering
course
Seikei University, Engineering Faculty, machine-engineering
course
National Space Development Agency of Japan, Engineering
Research Headquarters |
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| Theses published |
IMECE2004-61466: "Heatlane Technology for High Heat Flux Chip Cooling"
T. Katoh (TSH), M. Vogel (SUN), G. Xu (SUN), S. Novotny (Consultant)
2004 ASME International Mechanical Engineering Congress
And RD & D Expo (IMECE'04)
Date: November 13-19, 2004
Place: Anaheim Convention Center, Anaheim, CA |
Abstract
（PDF 10.7KB) |
NEW ATTEMPT OF FORCED-AIR COOLING
FOR HIGH HEAT-FLUX APPLICATIONS
ITHERM 2004
Date: June 3, 2004
Place: Las Vegas, Nevada, USA |
Abstract
（PDF 7.03KB) |
| Heat sinks for elements
using Heatlane™ technology (only in Japanese)
Paper announced at the thermal design & measures technology symposium held on April 18, 2002 at Makuhari Messe.
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Paper main body
（PDF 308KB) |
A reserch presentation
at 34th National Heattransfer Conference in year
2000
Sponsered by American Society of Mechanical Engineers
(ASME)
Date:August 20-22, 2000
Place: Pittsburgh, Pennsylvania, U.S.A. |
Abstract
(PDF 11KB) |
A body of the
paper
can be bought at
http://www.asme.org/ |
An abstract of reserch
presentation at 11th International Heat Pipe Conference
Sponsered by Japan Association for Heat Pipes and
Seikei Univ.
Date: September 12-16, 1999
Place: Musashino-shi, Tokyo, Japan |
Abstract
(PDF 13KB) |
Paper
(PDF 154KB) |
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